IBM researchers used the Hard X-ray Nanoprobe at NSLS-II to visualize strain in a new architecture for next-generation microelectronics
From smartphones to laptops, the demand for smaller and faster electronics is ever increasing. And as more everyday activities move to virtual formats, making consumer electronics more powerful and widely available is more important than ever.
IBM is one company at the forefront of this movement, researching ways to shrink and redesign their microelectronics—the transistors and other semiconductor devices that make up the small but mighty chips at the heart of all consumer electronics.
“As devices get smaller, it becomes more challenging to maintain electrostatic control,” said Conal Murray, a scientist at IBM’s T.J. Watson Research Center. “To ensure we can deliver the same level of performance in smaller devices, we’ve been employing new semiconductor materials and designs over the last decade.”
Read more on the NSLS-II website
Image: NSLS-II scientist Hanfei Yam is shown at the Hard X-ray Nanoprobe beamline, where IBM researchers visualised strain in a new architecture for next-generation microelectronics.