Scientists at Brookhaven Lab’s Center for Functional Nanomaterials created “hybrid” organic-inorganic materials for transferring ultrasmall, high-aspect-ratio features into silicon for next-generation electronic devices.
To increase the processing speed and reduce the power consumption of electronic devices, the microelectronics industry continues to push for smaller and smaller feature sizes. Transistors in today’s cell phones are typically 10 nanometers (nm) across—equivalent to about 50 silicon atoms wide—or smaller. Scaling transistors down below these dimensions with higher accuracy requires advanced materials for lithography—the primary technique for printing electrical circuit elements on silicon wafers to manufacture electronic chips. One challenge is developing robust “resists,” or materials that are used as templates for transferring circuit patterns into device-useful substrates such as silicon.
Image: (Left to right) Ashwanth Subramanian, Ming Lu, Kim Kisslinger, Chang-Yong Nam, and Nikhil Tiwale in the Electron Microscopy Facility at Brookhaven Lab’s Center for Functional Nanomaterials. The scientists used scanning electron microscopes to image high-resolution, high-aspect-ratio silicon nanostructures they etched using a “hybrid” organic-inorganic resist.